Tear-resistant adhesive/combination bond pattern
US6652501B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2001 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Nov 28, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24851
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Bonded composites, absorbent articles comprising such bonded composites, and processes for bonding thin-section elements. The bonded composite has first and second thin-section elements bonded to each other, at least in part by bond elements and at least in part by adherent material. The adherent material is disposed between the first and second thin-section elements proximate and about the bond elements. The adherent material, at least in part, bonds the thin-section elements to each other at loci of the adherent material. The bond patterns are arranged and configured to preferentially direct stresses imposed on the bond pattern, inwardly into the interior of the bond pattern for distribution, dissipation, and termination.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.