Graphitic allotrope interface composition and method of fabricating the same
US6652705B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2000 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | May 18, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An improved, more durable heat conductive composition for transferring heat from a heat-dissipating component to a heat dissipater and method of producing the same. The composition preferably comprises a base consisting of paraffin having particles of graphite suspended therein. In the preferred embodiment, the composition further includes a polymer to increase durability. The composition is formulated to be solid in the range of normal room temperatures, but liquify once subjected to temperatures just below the range at which heat generating electronic semi conductor devices typically operate. The present invention further comprises processes for transferring heat from a heat-dissipating component to a heat dissipater, which comprises applying the heat conductive composition to an interface between a heat-dissipating component and a heat sink. The compositions and methods of the present invention provide a highly efficient heat transfer which correspondingly produces system economic advantages and component liability enhancement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.