Method and apparatus for demounting workpieces from adhesive film
US6652707B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2002 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | May 29, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1967
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Demounting workpieces attached to an adhesive surface of an adhesive film with a workpiece demounting apparatus having a base and a plurality of substantially parallel blades mounted to the base. Each of the blades has a substantially linear blade edge, each blade edge lying within a blade-edge plane that is substantially perpendicular to the blades. The spacing between the blades is small enough to support said workpieces and large enough to permit the adhesive film to pass between the blades after being cut by said blade edges during a workpiece demounting operation. The plurality of blade edges thus provides a substantially planar blade-edge surface, in the blade-edge plane, for cutting the adhesive film and for supporting the workpieces while the adhesive film is pulled free from said workpieces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.