Coaxial transmission lines having grounding troughs on a printed circuit board
US6653915B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 1999 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Aug 20, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a coaxial transmission line on a high density PCB. A metal layer (102) on the PCB (104) forms the bottom part of the shield, and is covered by a first dielectric (112). Two parallel trenches (122) are formed in the first dielectric to reveal part (123) of the metal strip. The signal conductor (132) is then formed on the first dielectric. A second dielectric (142) covers the signal conductor and the first dielectric. A second set of two parallel trenches (172) are formed in the second dielectric immediately above the first two trenches. Metal deposit (182) is plated in the parallel trenches to contact the metal strip, and also covers a portion of the second dielectric that lies between the trenches, to create a shield. The resulting coaxial transmission line has a center conductor insulated from the shield by the dielectrics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.