Heat dissipation of low flow resistance in a notebook computer
US6654243B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 13, 2001 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Dec 13, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/203
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a heat dissipation apparatus for a notebook computer with a low flow resistance design. The notebook computer has a CPU, a heat dissipation apparatus, an air inlet, and an air outlet. The heat dissipation apparatus includes a heat sink, at least a fan, a conduction block, and a heat pipe. The heat sink is used to transmit heat. The conduction block is closely contacted to an upper surface of the CPU in the notebook computer for absorbing the heat from CPU. The heat pipe is connected to the conduction block and the heat sink. The heat pipe is configured for transmitting heat in the conduction block to the heat sink. Then, the heat transferred to the heat sink is carried away by air flow generated by the fan. In the invention, the air flow directions passing through the air inlet and the air outlet are parallel to each other. The air flow resistance is substantially reduced to accelerate the heat dissipation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.