Printed circuit board assembly having retention module and back plate
US6654254B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2002 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Jul 9, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T24/44026
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed circuit board assembly includes a printed circuit board (10), a retention module (20) mounted on the printed circuit board, and a back plate (30) attached to an underside of the printed circuit board opposite the retention module. The printed circuit board defines a plurality of through holes (16). The retention module defines a plurality of countersunk holes (25) therein, corresponding to the through holes of the printed circuit board. The back plate includes a base (32), and a plurality of latching posts (34) extending upwardly from the base. The latching posts extend through the through holes of the printed circuit board and engage in the countersunk holes of the retention module, thereby fixing the retention module to the printed circuit board. A plurality of fasteners (40) engages in the latching posts, thereby facilitating resilient engagement of the latching posts in the countersunk holes of the retention module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.