Directional coupling memory module
US6654270B2 · kind B2 · utility
19Cited by
13References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2002 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Jul 10, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C5/04
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Conventionally, wiring length occupied by a directional coupler decides intervals between modules connected to a bus, and those intervals can not be shortened furthermore. Accordingly, the intervals between modules are wide and high-density mounting is not possible. In the present invention, a directional coupler in a memory bus is formed by a leader line from a controller and a leader line from a memory chip and contained within a memory module. Accordingly, pitch between the modules can be reduced and high-density mounting can be realized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.