Chip component take-in apparatus
US6655547B2 · kind B2 · utility
2Cited by
10References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2001 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Aug 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/028
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A chip component take-in apparatus takes in and guides downward prismatic chip components stored in a bulk state in a storage chamber one by one in a predetermined direction. When a first take-in member and a second take-in member are relatively moved up and down in each flat face contact state, the chip components in face contact with the flat faces of the take-in members are gradually guided to a center along guide ways. The guided chip components in the longitudinal direction thereof are taken into a passage constituted by grooves and are moved downward along the passage by self-weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.