Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
US6656018B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2000 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Apr 10, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/22
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad for polishing semiconductors and other planar substrates in the presence of a slurry comprising abrasive particles and a dispersive agent is disclosed. The polishing pad includes a soluble component, preferably fibrous, within a polymer matrix component. The fibrous component includes fibers soluble in the slurry sufficiently to provide a void structure in the polishing surface of the pad. The void structure enhances the polishing rate and uniformity by increasing the mobility of the abrasive particles while reducing scratching of the polished surface. Additives that further enhance polishing and/or assist in the removal of residues generated during polishing, such as surfactants and removers, are optionally incorporated in the fibrous substance or topographically coated on the fibrous substance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.