Patent · US Expired

Soldering paste for hard-soldering and coating aluminum and aluminum alloys

US6656290B1 · kind B1 · utility

3Cited by

5References

16Claims

0Family size

Assignee

Degussa AG · DE

Inventors

Jurgen Koch · Refrath, DE
Leander Staab · Mömbris, DE
Wolfgang Kohlweiler · Frankfurt, DE
Karl-Anton Starz · Rodenbach, DE

Key dates

Filing date	Jul 15, 1998
Grant date	Dec 2, 2003
Priority date	—
Expiry date	Jun 19, 2020

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/12764
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A soldering paste for hard-soldering and coating working parts made of aluminum or aluminum alloys, which contains 25 to 35 percent in weight of a water-miscible organic binding agent on the basis of aliphatic glycols, 25 to 45 percent in weight of an aluminum hard-soldering powder, 25 to 45 percent in weight of an aluminum fluxing agent and, as an additive to influence the rheological properties, 0.01 to 0.2 percent by weight with respect to the total amount of one or several fatty acids with 10 to 20 C atoms and/or their ammonium salts.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.