Method for the manufacture of printed circuit boards
US6656370B1 · kind B1 · utility
1Cited by
10References
21Claims
0Family size
Inventors
Key dates
| Filing date | Oct 13, 2000 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Jul 10, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/244
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for the manufacture of printed circuit boards is disclosed wherein a plated silver deposit is used both as an etch resist and as a final finish for enhancing the solderability of the copper circuits. An aqueous alkaline etchant which is free of halide ions is proposed as being particularly compatible with the silver etch resist/final finish.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.