Adhesive compositions containing low molecular weight polymeric additives
US6657011B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2001 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Sep 13, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/302
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Adhesive compositions comprising (a) adhesive polymers or copolymers prepared from monomers selected from the group consisting of styrene, butadiene, acrylonitrile, ethylene, vinyl acetate, acrylic acid, esters of acrylic acid, methacrylic acid and esters of methacrylic acid or combinations thereof; and (b) from 1 to 55% on a dry weight basis of a polymeric additive comprising a low molecular weight polymer having a number average molecular weight of 20,000 or less and which comprises polymerized units of at least one ethylenically unsaturated monomer and 5 weight percent or less of a polymerized acid-containing monomer. In preferred form, the polymeric additive is polymerized in the presence of a metal chelate chain transfer agent. In certain embodiments, the polymeric additive has a midpoint Tg of at least 0° C. or greater. Further embodiments of the present invention include methods for forming the polymeric additive in situ in the adhesive composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.