Connection structure and electronic circuit board
US6657135B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2002 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Feb 22, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/099
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A connection structure of the present invention has a board with a through hole perforating therethrough, a land formed around the through hole, and a lead extending from an electronic component and disposed in the through hole. The land includes a wall surface land portion formed on a wall surface of the through hole, and front and back surface land portions formed on the front and back surfaces of the board respectively. A fillet connecting the land and the lead includes upper and lower fillet portions respectively contacting with the front and back surface land portions. A profile of the upper fillet portion is smaller than that of the lower fillet portion and is not smaller than that of the through hole. Therefore, occurrence of lift-off is effectively reduced while using a lead-free solder material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.