Patent · US Expired

Monolithically integrated electronic device and fabrication process therefor

US6657262B2 · kind B2 · utility

63Cited by
5References
13Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMar 30, 2001
Grant dateDec 2, 2003
Priority date
Expiry dateJun 21, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D84/401

Abstract

An electronic device, integrated monolithically in a semiconductor substrate and comprising a bipolar transistor connected in series to at least one MOS transistor, the bipolar transistor having a base region that includes a first buried region and a first diffused region extending continuously from the substrate surface down to the buried region, and the diffused region is bordered by an isolation trench region extending in the buried region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.