Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing method
US6657306B1 · kind B1 · utility
3Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2000 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Nov 28, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/977
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Form a trench in a major surface of a semiconductor substrate, then bury a paste in the trench. The paste contains solids having a conductive substance and a resin, and solvent for dissolving the resin. The solids content of the paste is not less than 60 vol % and a viscosity ratio thereof is not more than 2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.