Head
US6657827B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2000 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Sep 25, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B7/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A head includes a head chip, having first and second external connection electrodes, for reading a signal from a storage medium and writing a signal on the storage medium, a substrate having the head chip mounted thereon, a hot-side conductor path and a ground-side conductor path each formed on the surface of the substrate and electrically connected to the corresponding external connection electrodes of the head chip, and a chip varistor, mounted on the substrate, having first, second, and third terminal electrodes, the third terminal electrode being connected to the ground. In the head, the hot-side conductor path is divided, and the corresponding conductor parts of ends of the divided hot-side conductor paths are electrically connected to the first and the second terminal electrodes, and the ground-side conductor path is electrically connected to the third terminal electrode of the chip varistor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.