Wafer bonded vertical cavity surface emitting laser systems
US6658041B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 20, 2002 |
| Grant date | Dec 2, 2003 |
| Priority date | — |
| Expiry date | Mar 20, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/18333
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Vertical cavity surface emitting laser systems and methods of making the same are described. In one aspect, a vertical cavity surface emitting laser system has a bottom side that may be flip-chip mounted to a driver substrate and a top side that is configured to transmit light through an optically transparent substrate. By this configuration, vertical cavity surface emitting laser systems may be packed together with a greater density and operated at greater speeds relative to, for example, wire bonded vertical cavity surface emitting laser systems. In addition, such systems may be flexibly tailored to produce light over a wide range of wavelengths. Such systems also may be efficiently packaged on a wafer scale.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.