Method for fabricating connectors for interconnecting etched tri-metal circuit structures
US6658731B1 · kind B1 · utility
2Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2000 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Jul 26, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In conventional ETM circuit structures a pin connector in which the pin is etched from the ETM substrate and the mating cavity is etched from the ETM substrate to be mated. The connector utilizes the subtractive ETM structure processing to define any one of several pin-cavity configurations. The pin serves as an anchor with the metallurgical bonds with solder in the cavity that forms on the copper surfaces of the ETM circuit structure to give good mechanical strength to the connection. In particular four different configurations of interconnections are shown and described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.