Method for forming end-face electrode
US6659334B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2001 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Sep 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/043
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is provided a method for forming end-face electrodes in which the end-face electrode can be securely formed with solder at a position in which a side electrode is formed and it can be formed without being affected by a jig for fixing a solder solid. By forming linear gaps on a master substrate, module substrates and a waste substrate are formed. At the side end of the gap of the module substrate, a side electrode is formed. A solder solid is pressed into the part of the gap in which the side electrode is formed and a reflow jig is placed. The surface of the solder solid is coated with flux and the solder solid is melted by heating so as to form the end-face electrode protruding from the substrate surface in the side electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.