Cover tape cutting system using a thermal energy source
US6659705B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2002 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Jan 9, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1906
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is a method and apparatus for cutting the cover tape on a component carrier tape in order to allow component retrieval by an automated assembly system. More specifically, the cover tape is cut using a radiant energy beam that vaporizes the cover tape layer so as to partially expose the component below. The cover tape flap(s) created by the cutting operation may then be folded back so as to expose the component for retrieval at the pick-up location. Subsequent to the pick-up location, the carrier tape with the parted cover tape flap(s) attached thereto, are directed to a waste receptacle or similar disposal mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.