Elemental silicon nanoparticle plating and method for the same

US6660152B2 · kind B2 · utility

Assignee

• The Board of Trustees of the University of Illinois · US

Inventors

• Munir H. Nayfeh · Urbana, US
• Gennadiy Belomoin · Wheeling, US
• Adam Smith · San Francisco, US
• Taysir H. Nayfeh · Cleveland, US

Key dates

• Filing date: Nov 15, 2001
• Grant date: Dec 9, 2003
• Expiry date: Nov 15, 2021

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D5/02
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

According to the invention, silicon nanoparticles are applied to a substrate using an electrochemical plating processes, analogous to metal plating. An electrolysis tank of an aqueous or non-aqueous solution, such as alcohol, ether, or other solvents in which the particles are dissolved operates at a current flow between the electrodes. In applying silicon nanoparticles to a silicon, metal, or non-conducting substrate, a selective area plating may be accomplished by defining areas of different conductivity on the substrate. Silicon nanoparticle composite platings and stacked alternating material platings are also possible. The addition of metal ions into the silicon nanoparticle solution produces a composite material plating. Either composite silicon nanoparticle platings or pure silicon nanoparticle platings may be stacked with each other or with convention metal platings.