Heat-sensitive composition and planographic printing plate
US6660446B2 · kind B2 · utility
5Cited by
10References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 2001 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Oct 4, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/146
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A heat-sensitive composition comprising a compound of a specific general formula which generates an acid or radical when heated, and a compound whose physical and chemical properties are irreversibly changed by an acid or radical.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.