Method of forming conductive pattern
US6660457B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2001 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | May 23, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method of forming a conductive pattern, comprising the steps of:(1) depositing a conductive coating-forming resin layer and an energy beam-sensitive coating layer on a substrate in this order;(2) irradiating a surface of the energy beam-sensitive coating layer with an active energy beam or heat rays directly or through a mask, so as to obtain a desired pattern;(3) developing the energy beam-sensitive coating layer to form a resist pattern coating from the energy beam-sensitive coating layer; and(4) removing revealed portions of the conductive coating-forming resin layer by development.The present invention also provides a method of forming a conductive pattern, comprising the step (1), the step (2), and the step of:(3′) developing the energy beam-sensitive coating layer and the conductive coating-forming resin layer simultaneously.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.