Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin
US6660946B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2001 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Sep 16, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49151
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A pin standing resin substrate comprises: a resin substrate having a substantially plate-shaped main surface and comprising one of a resin and a composite material containing a resin, with a pin-pad exposed from the main surface; and a pin solder-jointed to the pin-pad, wherein the pin has been subjected to thermal treatment so as to soften the pin, and comprises a rod-like portion and an enlarged diameter portion having the same material as the rod-like portion, the enlarged diameter portion having a larger diameter than the rod-like portion and being formed at one end of the rod-like portion, and at least the enlarged diameter portion is soldered to the pin-pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.