Method and apparatus for separating non-metallic materials
US6660963B2 · kind B2 · utility
24Cited by
41References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2002 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Jul 16, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/307
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking devices receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.