Radio frequency circuit module on multi-layer substrate
US6661318B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 2001 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Sep 12, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10356
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.