Structure and fabrication process for integrated moving-coil magnetic micro-actuator
US6661617B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2000 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Mar 27, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/5552
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A moving-coil magnetic microactuator is formed by using a dual silicon wafer structure and thin film technologies such as deep trench reactive ion etching, reactive ion etching, plasma-enhanced chemical vapor deposition and metallo-organinc chemical vapor deposition. Several bottom structures are formed from a bottom wafer, each bottom structure having a coil and wires embedded in the surface of the bottom structure. Several top structures are formed from a top wafer, each top structure having a magnet and mechanical stand-offs. The top structures are bonded to the bottom structures so that the magnet is above the embedded coil, separated by an air gap created by the mechanical stand-offs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.