Dielectric structure
US6661642B2 · kind B2 · utility
12Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2002 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Oct 10, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/692
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Multilayer dielectric structures particularly suitable for use in capacitors and having a plating dopant in an amount sufficient to promote plating of a conductive layer are provided, together with methods of forming such structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.