Fluid-cooled heat sink for electronic components
US6661658B2 · kind B2 · utility
11Cited by
12References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2002 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Apr 12, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fluid-cooled heat sink for electronic components includes a first metal plate designed to be positioned in contact with at least one electronic component and a second plate having a first face and a second face. The first face of the second plate is joined to the first plate. The first face of the second plate has a groove formed therein for accommodating a cooling liquid. The first face and the second face of the second plate are parallel at least along the length of the groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.