Vehicular modular design multiple application rectifier assembly
US6661662B2 · kind B2 · utility
9Cited by
23References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 19, 2002 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Jul 12, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A rectifier assembly includes two substantially identical and interchangeable heat sink plates mounted parallel to each other in spaced relation. Each heat sink plate has identically positioned diode mounting holes. A plurality of rectifier diodes are mounted within the diode mounting holes. Each diode has a diode electrode. One plate is selectively negative or positive depending on the plurality of diodes mounted within the plate such that one heat sink plate is negative and the other heat sink plate is positive. The diode mounting holes not receiving diodes therein provide diode electrode clearance and ventilation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.