Electronic module with high cooling power
US6661664B2 · kind B2 · utility
31Cited by
11References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2002 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | May 13, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure to improve the cooling of electronic modules of the type including a printed circuit board contained between two covers. The structure extracts, by at least one of the covers, heat produced by at least one component borne by the printed circuit board. According to one feature, the cover responsible for extracting the heat bears at least one device having a high thermal conductivity, making it possible to even out the temperatures of the surface of the cover with which it is in contact. Such a structure may be particularly applied to the electronic modules on board aircraft.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.