Method and apparatus for designing printed-circuit board
US6662345B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2002 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | May 28, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3494
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A thermal analysis in heating a print-circuit board in a reflowing furnace is simulated by a processor using data required for the design and thermal analysis of the printed-circuit board that carries solder-bonded components. The result of simulation indicates the possibility of existence of unmelted solder bonds heated at peak temperature below a predetermined lower limit and solder bonds heated at temperature above a predetermined upper limit. On the basis of the result, the components that are likely to be heated at inapplicable temperature are redesigned so that they can actually be heated at temperature in the predetermined range. The modification of design is displayed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.