Electronic surface mount package
US6662431B1 · kind B1 · utility
7Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2002 |
| Grant date | Dec 16, 2003 |
| Priority date | — |
| Expiry date | Feb 5, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49073
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.