High density electrical connector assembly
US6663427B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2002 |
| Grant date | Dec 16, 2003 |
| Priority date | — |
| Expiry date | Jul 9, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/724
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrical connector assembly comprises a receptacle (1) and a header (8). The receptacle comprises a first interface connection piece (20) including a plurality of first wafers (21) assembled together to define a plurality of slots (200) between adjacent first wafers. Each first wafer includes a plurality of signal terminals and a grounding member mounted on opposite sides of a dielectric base thereof. A plurality of daughter circuit boards (30) each has a first mating portion (302) and a second mating portion (300). The mounting portions are inserted into the slots of the first interface connection piece and engage with the signal contacts and the grounding member. The header has a second interface connection piece (90) including a plurality of second wafers (91) assembled together to define a plurality of slots (900) between adjacent second wafers. Each second wafer has an identical construction with that of the first wafer. The second mating portions are inserted into the slots of second interface connection piece and engage with signal contacts and grounding member of the second wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.