Method for manufacturing high density electrical connector assembly
US6663429B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2002 |
| Grant date | Dec 16, 2003 |
| Priority date | — |
| Expiry date | Aug 29, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/514
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing an electrical connector assembly (100) comprises the steps of: (a) providing a plurality of first wafers (21) each having a first block (25) and a second block (26) disposed on opposite surfaces; (b) inserting terminals (23) into corresponding first wafers and inserting a plurality of grounding buses (24) between every two adjacent first wafers to defines a first spacer (20), each grounding bus including a body portion and a contacting legs (242) on the surfaces of corresponding first spacer; (c) inserting a plurality of circuit boards (30) into slots (27) between the first wafers, in which the circuit boards electrically engage the grounding buses; (d) bringing the first spacer and the circuit boards into a housing (10) to form a receptacle (1); (e) repeating the steps (a) to (d) to form a second spacer (90) having identical structure with the first spacer; and (f) inserting the second spacer into a second housing (82) to form a header (8), inserting the header into the receptacle to electrically connect each other thereby forming the electrical connector assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.