Method for crystallizing silicon film and thin film transistor and fabricating method using the same
US6664152B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 31, 2002 |
| Grant date | Dec 16, 2003 |
| Priority date | — |
| Expiry date | Apr 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/0227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for crystallizing an amorphous silicon film which includes the steps of: preparing a substrate having the amorphous silicon film, the amorphous silicon film being formed on an intermediate layer in which an inner space exists; applying an energy to the amorphous silicon film in order to crystallize the amorphous silicon film, wherein the step of preparing the substrate includes the steps of: forming a material layer for forming the space on an insulating substrate, forming the intermediate layer to cover the material layer, forming the amorphous silicon film on the intermediate layer, selectively removing the amorphous silicon film and the intermediate layer to expose a part of the material layer for forming space, and removing the material layer for forming space; or forming a material layer for forming the space on an insulating substrate, forming the intermediate layer to cover the material layer, selectively removing the intermediate layer to expose a part of the material layer, removing the material layer, and forming the amorphous silicon film on the intermediate layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.