Encapsulant compositions with thermal shock resistance
US6664318B1 · kind B1 · utility
49Cited by
13References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 1999 |
| Grant date | Dec 16, 2003 |
| Priority date | — |
| Expiry date | Dec 20, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermomechanical-shock-resistant cured composition for solventless, hydrophobic resin encapsulation of electronic components having a glass transition temperature below 0° C. and containing a non-silicone oligomer including a flexible hydrocarbon backbone with reactive functionality, up to about 40% by weight of an adhesion promoter, and a optional viscosity-modifying component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.