Phenolic resin composition
US6664343B2 · kind B2 · utility
63Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2002 |
| Grant date | Dec 16, 2003 |
| Priority date | — |
| Expiry date | Feb 12, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L61/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A phenolic resin composition which is stable against an environmental moisture change and, further, excellent in fast curing property, flexibility and heat resistance. The phenolic resin composition contains 70-97% by weight of a phenolic resin and 3-30% by weight of a silicone-based rubber component and has a ratio of an ortho-bonding to a para-bonding at a methylene bonding in the phenolic resin of 2-9.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.