Flexible printed circuit board
US6664479B2 · kind B2 · utility
5Cited by
16References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2001 |
| Grant date | Dec 16, 2003 |
| Priority date | — |
| Expiry date | Apr 27, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/281
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible printed circuit board (FPC) comprises a base film; a base film side adhesive layer provided on the base film; a metal foil layer on which a pattern circuit is formed, provided on the base film side adhesive layer; and a cover layer side adhesive layer provided on the metal foil layer, wherein at least one of the base film side adhesive and the cover layer side adhesive layer has a higher glass transition temperature than an operating temperature of the flexible printed circuit board, so that the FPC has a stable flexibility at high temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.