Arrangement for enabling trimming on a substrate and a method of producing a substrate that enables trimming
US6664481B1 · kind B1 · utility
4Cited by
9References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 16, 2000 |
| Grant date | Dec 16, 2003 |
| Priority date | — |
| Expiry date | Mar 16, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for trimming a discrete surface-mounted component or a component integrated in a substrate including providing a trimmable structure mounted on the surface of a substrate for each component to be trimmed. In an exemplary embodiment, the component to be trimmed is a capacitor. In another exemplary embodiment, the trimmable structure is one electrode of a trimmable capacitor whose other electrode is integrated in the substrate, and the trimmable capacitor is connected in parallel with a surface mounted capacitor to be trimmed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.