Method and apparatus for increasing the material removal rate in laser machining
US6664498B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2002 |
| Grant date | Dec 16, 2003 |
| Priority date | — |
| Expiry date | Apr 10, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/0624
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods and apparatus for material modification using laser bursts including appropriately timed laser pulses to enhance material modification. In one implementation, a method for material modification comprises the steps of: providing bursts of laser pulses, wherein each burst comprises at least two laser pulses, wherein each laser pulse has a pulse duration within a range of between approximately 10 ps and 100 ns, wherein a time between each laser pulse of each burst is within a range of between approximately 5 ns and 5 &mgr;s; a time between successive bursts is greater than the time between each laser pulse comprising each burst; and directing the bursts upon a workpiece, wherein an intensity of a primary laser pulse of each burst exceeds a damage threshold of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.