METHOD OF MOUNTING A SEMICONDUCTOR CHIP, CIRCUIT BOARD FOR FLIP-CHIP CONNECTION AND METHOD OF MANUFACTURING THE SAME, ELECTROMAGNETIC WAVE READABLE DATA CARRIER AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC COMPONENT MODULE FOR AN ELECTROMAGNETIC WAVE READABLE DATA CARRIER
US6664645B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 16, 2002 |
| Grant date | Dec 16, 2003 |
| Priority date | — |
| Expiry date | Apr 16, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1189
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To provide a semiconductor chip mounting method by a flip-chip connection method in which a semiconductor chip can be mounted on a circuit board promptly, electrically and mechanically surely and further at a low cost, a process for pushing a melted thermoplastic resin coat aside by pressing a bump of the bare semiconductor chip on the melted thermoplastic resin coat applying an ultrasonic wave in a state in which the thermoplastic resin coat covering an electrode area on a wiring pattern is heated and melted and touching the bump and the electrode area, a process for bonding the bump and the electrode area by continuously applying an ultrasonic wave in a state in which the bump and the electrode area are touched and a process for cooling and solidifying the melted thermoplastic resin coat and bonding the body of the bare semiconductor chip on the circuit board are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.