Bonding method and bonding device of substrates and manufacturing method of a liquid crystal display device
US6665043B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2000 |
| Grant date | Dec 16, 2003 |
| Priority date | — |
| Expiry date | Jun 28, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/133354
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A substrate bonding method in which a pair of masks which were prepared by forming a recessed section at a center part of each flat plate are placed on upper and lower stages, respectively, so that the recessed sections face a CF substrate and a TFT substrate, the CF substrate and TFT substrate are positioned one upon another and bonded together by sandwiching them between the masks. With this method, not only the CF substrate and TFT substrate are protected by the recessed sections from both sides, but also the dimensions of a region of each of the CF substrate and TFT substrate protected by the recessed sections are easily changed by replacing the masks. It is thus possible to provide a substrate bonding method that can readily meet the manufacture of bonded substrates of a variety of dimensions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.