Power supply apparatus
US6665183B1 · kind B1 · utility
33Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2003 |
| Grant date | Dec 16, 2003 |
| Priority date | — |
| Expiry date | Feb 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20918
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A power supply apparatus has chassis (42, 44) mounted on opposing surfaces of a heat sink (40). Printed circuit boards (46, 48) are disposed outward of the chassis (42, 44) and detachably secured to the chassis (42, 44). Semiconductor modules (4, 16a, 16b, 32) are mounted on the respective surfaces of the heat sink (40) facing toward the printed circuit boards (46, 48) and extend through the chassis (42, 44). The semiconductor modules (4, 16a, 16b, 32) are electrically connected to the printed circuit boards (46, 48) to form a power supply circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.