Multi-folded printed wiring construction for an implantable medical device
US6665191B2 · kind B2 · utility
24Cited by
28References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2001 |
| Grant date | Dec 16, 2003 |
| Priority date | — |
| Expiry date | Nov 13, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/189
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A printed circuit assembly for use in an implantable medical device comprises a plurality of panels having active and passive circuit components on one major surface thereof, the plurality of panels being interconnected with flexible flat cable segments allowing the assembly to be folded so as to place the individual panels carrying the circuit components in a stacked relationship. By providing conductive layers on predetermined surfaces of the panels, shielding is provided to inhibit noise generating circuitry from contaminating wanted signals passing between the components and the plural panels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.