Structure of an image-sensing module
US6665455B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 14, 2000 |
| Grant date | Dec 16, 2003 |
| Priority date | — |
| Expiry date | Jul 23, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/52
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure of an image-sensing module includes: a top cover; a bottom cover; a set of optical lenses module; at least an elastic pressing strap; an image-sensing transistor; and a soft-tppe circuit board in combination with the image-sensing transistor in transmitting electrical signals, wherein the top cover is provided with a through hole for the engagement with the optical lenses module, and the mounting face between the top cover and the bottom cover is provided with a protruded and depressed bodies for locking with each other, such that the top and the bottom covers can be sealed or detached, and within the interior of the top cover and the bottom cover, the image-sensing transistor, the elastic pressing straps and the soft-type circuit board connected to the image-sensing transistor are stacked with one another, such that the top cover, by means of a lower pressing-strap, causes the soft-type circuit board stacked and connected with the image-sensing transistor portion to mutually press against each other, and the image-sensing transistor urgingly connected at the internal surface of the bottom cover, and the sensing portion faces the position mounted with the optical lenses…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.