Reduced profile EMI receptacle assembly
US6666694B1 · kind B1 · utility
22Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2002 |
| Grant date | Dec 23, 2003 |
| Priority date | — |
| Expiry date | Aug 21, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6595
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides for a receptacle printed circuit board assembly having a reduced profile of the entire assembly where the receptacle has a board receiving portion that mounts at a cut-out edge of a printed circuit board so that the majority of the receptacle is mounted within a cut-out area of the printed circuit board recessed below the upper face of the printed circuit board so that the overall profile of the receptacle assembly is reduced. A shield flap or metallic hood is provided that helps to attach the receptacle to the printed circuit board and completely enclose the shielded portion of the receptacle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.