Thermoformable multilayer film for the protection of substrates and objects obtained
US6667101B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2001 |
| Grant date | Dec 23, 2003 |
| Priority date | — |
| Expiry date | Feb 21, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a thermoformable multilayer film comprising in succession:a protective layer (A);a transparent layer (B) comprising (by weight the total amount being 100%) 0 to 100% of a fluoropolymer (B1) and 100 to 0% of a polymer (B2) essentially consisting of alkyl (meth)acrylate units;a layer (C) based on a polyamide with amine terminal groups;a layer (D) consisting of a polyolefin functionalized by an unsaturated carboxylic acid anhydride;a bonding layer (E) made of a polyolefin, said film being obtained by coextruding the various layers, said film being used to cover various substrates, for example by injection-moulding the substrate in the melt onto the multilayer film placed in the bottom of an injection mould, the layer (A) of the film being placed against the wall of the mould.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.