LED package
US6667497B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2002 |
| Grant date | Dec 23, 2003 |
| Priority date | — |
| Expiry date | Oct 17, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A LED package is comprised of a flat panel base and three LED dies. The flat panel base is composed of a first golden film area, a second golden film area, a third golden film area, a fourth golden film area, a first connection area, and a second connection area, wherein the first connection area and the second connection area are connected to the first golden film area. The first LED die is attached on the flat panel base by flip-chip mounting, wherein an anode of the first LED die is connected to the first golden film area, and a cathode of the first LED die is connected to the second golden film area. The second LED die is attached on the flat panel base by flip-chip mounting, wherein the second LED die is composed of an anode connected to the first golden film area, and a cathode connected to the fourth golden film area. The third LED die is attached on the third golden film area; wherein the third LED die is composed of an anode connected to the first golden film area by a metallic wire, and a cathode connected to the third golden film area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.