Attachment of a single heat dissipation device to multiple components with vibration isolation
US6667885B2 · kind B2 · utility
11Cited by
12References
77Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2001 |
| Grant date | Dec 23, 2003 |
| Priority date | — |
| Expiry date | Jul 20, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus to attach multiple components to a common heat dissipation device. One embodiment of the invention involves a method to assemble a plurality of components on a substrate to a heat dissipation device. A second embodiment of the invention involves another method to assemble a plurality of components on a substrate to a heat dissipation device containing one or more heat-pipes. A third embodiment of the invention involves an assembled substrate with a plurality of electrical components attached to a common heat dissipation device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.